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SILICONE :: |
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Silicone
Heat Transfer Compound |
DESCRIPTION :
Unick Silicone Heat Transfer Compound is a grease-like silicone
material, heavily filled with heat-conductive matal oxides.
This combination of base and fillers produces a material with
higher thermal conductivity.
The low bleed properties of this improved compound assure
lasting protection for heat sink coupling.
USES :
Unick Silicone Heat Transfer Compound is applied to the base
and mounting studs of transistors and diodes. It is also an
effective thermal coupler for any heat sink divice where efficient
cooling is required. This silicone compound will not dry out,
harden, or melt even after long term exposure to temperatures
up to 200°C. It maintains a positive heat sink seal that
improves
heat transfer from the device to the heat sink or chassis, thereby
increasing overall efficiency of the device.
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| TYPICAL
PROPERTIES |
| Color
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White Opaque |
| Consistency |
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Penetration, worked (60) and measured within one minute |
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after working (ASTM D 217)
-----------------------------------------------------------------------------
260 |
| Bleed, percent
after 24 hours at 200°C
------------------------------------------------------------------- 1.0 |
| Evaporation,
percent after 24 hours at 200°C
---------------------------------------------------------- 1.0 |
| Specific Gravity at
25°C
---------------------------------------------------------------------------------------
2.3 |
| Thermal
Conductivity, K Factor, cal / cm2 / °C / sec / cm
--------------------------------------- 0.0015 |
| Dielectric strength,
KV at 0.1mm, ASTM D-149
------------------------------------------------------- 1.0 |
| Volume Resistivity |
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Ohm-cm ASTM D-257
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1x1014 |
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